原子间相互交替施受或互换价电子是金属键合的基本模式。
Metal atoms mutually donating and accepting or exchanging valence electrons are the fundamental modes of metal binding.
制备交联剂的方法，包括引入具有共价键合的磷原子的侧基。
A process to produce a crosslinker includes incorporating a pendent group comprising a covalently bonded phosphorous atom.
根据煤矸石硅铝基胶凝材料的特征提出了原位键合的水化机理。
Based on the properties of gangue-containing aluminosilicate based cementitious materials, in situ bonding hydration mechanism was put forward.
引线键合的效率主要依赖于受表面特性影响的键合点的可焊性。
The yield of wire bond mainly depends on the bondability of the bond pad which is affected by the surface characteristics.
本文简要描述了陶瓷外壳封装集成电路自动铝丝楔焊键合的工序检查。
This paper simply described the process inspection of automation Al wire ultrasonic wedge bonding in ceramic packaging IC.
通过这些研究和比较证明了明胶介质的钙是与磷酸化的蛋白组分键合的。
The results show that the calcium in gelatin medium is bound to the phosphoratedprotein components.
红外光谱和电化学实验均证实碳纳米管和色氨酸是通过酰胺键共价键合的。
Both the IR and electrochemical experiments proved that tryptophan and MWNT covalently bonded with each other through amide bonds.
探讨了使用湿化学法对硅片表面进行活化，完成硅圆片低温直接键合的流程。
The process of low temperature wafer direct bonding using wet chemical surface activation methods are discussed.
具有共价键合的磷原子的交联剂，所述磷原子具有至少一个共价键合的氧原子。
Crosslinkers having a covalently bonded phosphorous atom, the phosphorous atom having at least one covalently bonded oxygen atom.
分析了金硅共晶键合的基本原理，讨论了键合实验的基本工艺，给出了键合的测试结果。
The principle of eutectic bonding was analyzed. The fabrication process of eutectic bonding was discussed, the test result of eutectic bonding was given.
分析了金丝与金导体键合的可靠性问题，总结了金丝键合失效的原因，并提出了改进的措施。
Then it analyzes the reliability problems of the bonding between spun gold and gold conductor, and proposes an improved measure after summarizing the causation of spun gold bonding fault.
在芯片测试中，若引线焊盘上的铝层被探针扎穿，就会影响引线键合的牢固性和器件的可靠性。
If the Al film on the bond pad is pierced through by the probe in wafer probing, the wire bonding strength and device reliability would be affected.
阴阳混合离子交换树脂可以使键合态紫杉醇发生裂解，脱去键合的大分子物质，游离出紫杉醇。
Cation - anion exchange resin can crack and disassemble bond - chromatography, doff the bond - large - molecule and dissociate paclitaxel.
刚性粒子表面带环氧官能团后，与基本材料形成了化学键合的界面层结构，对粒子的增韧也十分有利。
The data also show that the particle surface having some epoxy groups can be of great advantage to toughening because the chemical bond is formed in the interphase between particle and matrix.
合成了三种与咪唑配体键合的新型载体，并通过其与四苯基卟啉铁和卟啉锰配位得到了改性的负载金属卟啉催化剂。
Three new supporters bonded with ligand imidazole have been prepared. Modified catalysts of metalloporphyrins have been obtained by coordination of TPPFeCl or TPPMnCl with supporters.
实验表明，CF4对硅片的处理不仅可以激活表面，而且可以对硅片 表面进行有效的抛光，大大加强了预键合的效果。
The experiments show that CF4 treatment to silicon wafers can not only activate them but also polish their surfaces effectively, and it can improve the pre-bonding greatly.
配位共价键是其中两个键合电子均来自该键所涉及的原子之一的键。
A coordinate covalent bond is one where both bonding electrons are from one of the atoms involved in the bond.
这个这儿的区域指的的了键合区域。
科学家们忙于填补元素周期表的空白、探索未知的原子现象(如放射性和键合)。
Boffins were busily filling in the blanks in the periodic table and probing unknown atomic phenomena (like radioactivity and bonding).
s和1s上两个电子组成的键合电子成椭圆形,这是成键，这是反键电子，这些是刚刚已经画过的能级,我也给你们画了。
s plus 1s gives you this oval ellipsoid which is the bonding, and here are the antibonding, and then these are the energy levels that I have been drawing for you.
以此为基础阐述了建立平面多体机械系统键合图模型的一般方法及其动力学原理。
Based on this, the generic procedure of modeling planar multibody mechanical systems by bond graphs and its dynamic principle are described.
摘要晶片直接键合技术是材料集成的一项新工艺，是近年来集成光电子领域的研究热点之一。
Direct wafer bonding is a new process of material integrating and has received tremendous attention in the research of optoelectronics and microelectronics field.
文中提出的功率键合图建模方法能够较好地完成对人体循环系统建立仿真模型的工作，并对一个简化的循环系统生理模型进行了计算机仿真研究。
In this paper, the Power Band Graph (PBG) modeling method is used to realize modeling of the human circulation system and conduct a simulation study on a simplified physiological system model.
在MEMS器件的设计与加工过程中，键合技术是体硅工艺的一项关键技术。
In the design and fabrication of MEMS devices, MEMS fabrication process based on Silicon is a main technology, to which is deeply paid attention by researchers and industries.
分析了键合强度与键合温度之间的关系。
The relationship of bonding strength and temperature are investigated.
阐述了建立空间多体系统键合图模型的一般方法及其动力学原理。
The method of modeling spatial multibody systems by bond graphs and its dynamic principle are described.
BP网络用于金丝键合质量的预报具有可行性和有效性。
That BP network used for predicting quality of wire bonding is feasible and valid.
结果表明：基板内部的银导体不存在迁移现象，导体的附着力、键合强度以及基板的绝缘电阻等性能均比较理想。
The results show that there is not any evidence of silver migration within LTCC construction, and conductor adhesive force, wire-bonding strength and insulation resistance are high.
结果表明：基板内部的银导体不存在迁移现象，导体的附着力、键合强度以及基板的绝缘电阻等性能均比较理想。
The results show that there is not any evidence of silver migration within LTCC construction, and conductor adhesive force, wire-bonding strength and insulation resistance are high.
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