原子间相互交替施受或互换价电子是金属键合的基本模式。
Metal atoms mutually donating and accepting or exchanging valence electrons are the fundamental modes of metal binding.
根据煤矸石硅铝基胶凝材料的特征提出了原位键合的水化机理。
Based on the properties of gangue-containing aluminosilicate based cementitious materials, in situ bonding hydration mechanism was put forward.
本文简要描述了陶瓷外壳封装集成电路自动铝丝楔焊键合的工序检查。
This paper simply described the process inspection of automation Al wire ultrasonic wedge bonding in ceramic packaging IC.
This region in here contained the bonding domains.
这个这儿的区域指的的了键合区域。
s plus 1s gives you this oval ellipsoid which is the bonding, and here are the antibonding, and then these are the energy levels that I have been drawing for you.
s和1s上两个电子组成的键合电子成椭圆形,这是成键,这是反键电子,这些是刚刚已经画过的能级,我也给你们画了。
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