需要注意的是，上面所说的200mm规格产线计划6月15日恢复量产，此日期指的是工厂可以开始接受200mm晶圆片开始加工的日期，而从晶圆片上制出芯片并对其进行封装，制成可以直接销售给客户的成品，则可能需要再等上2.5-3个月。
The June 15 date is a wafers-in start date. It can take up to three months for a wafer to be processed and packaged for shipment to customers.
这些加工过程对人体的危害很大，因此大多数工作都在密封室中进行，机械手臂会把晶圆从一个加工区移到另一个加工区。
Because those processes aren't exactly friendly to humans, much of this work happens inside sealed Chambers where robot arms move the wafers from one processing station to another.
绿色的“非金属添加工具（metalfreetool）”标志意味着硅晶圆必须得经过这台机器的处理以后，才能去添加铜质电路。
The green "metal free tool" sign indicates that this machine is used in a part of the process prior to the addition of copper circuits.
加工测试晶圆片䏐-用于区域清洁过程中的晶圆片。
Processs Test wafer - a wafer that can be used for processes as well as area cleanliness.
半导体晶圆背面加工方法，衬底背面加工方法，和辐射固化型压敏粘着片。
Method of semiconductor wafer back processing, method of substrate back processing, and radiation-curable pressure-sensitive adhesive sheet.
本论文对紫外激光应用于蓝宝石晶圆和碳化硅等材料的划切加工技术进行了部分理论与试验研究工作。
In this paper, part of theoretical and experimental studies on the application of UV laser in dicing of sapphire wafer and SiC were presented.
世界各地的许多公司正在开发或已经开始提供设备加工和包装的晶圆格式。
A number of companies around the world are developing or have begun offering devices processed and packaged in the wafer format.
通过对半导体加工工艺的分析研究，提出了用磨料水射流切割半导体材料，包括晶圆的切割、芯片的终端封装切割。
After an analysis of the process of semiconductor fabrication, a proposal of the wafer dicing using micro-abrasive waterjet is put forward.
又可称为晶圆电阻、圆柱型电阻、无引脚电阻、或无引线电阻，主要用于表面贴装加工过程。
RJM resistor MELF Resistors also can be called a wafer resistance, cylindrical-type resistance, non-pin resistance, or non-lead resistance, mainly used for surface mount processing.
又可称为晶圆电阻、圆柱型电阻、无引脚电阻、或无引线电阻，主要用于表面贴装加工过程。
RJM resistor MELF Resistors also can be called a wafer resistance, cylindrical-type resistance, non-pin resistance, or non-lead resistance, mainly used for surface mount processing.
应用推荐