需要注意的是，上面所说的200mm规格产线计划6月15日恢复量产，此日期指的是工厂可以开始接受200mm晶圆片开始加工的日期，而从晶圆片上制出芯片并对其进行封装，制成可以直接销售给客户的成品，则可能需要再等上2.5-3个月。

The June 15 date is a wafers-in start date. It can take up to three months for a wafer to be processed and packaged for shipment to customers.

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这些加工过程对人体的危害很大，因此大多数工作都在密封室中进行，机械手臂会把晶圆从一个加工区移到另一个加工区。

Because those processes aren't exactly friendly to humans, much of this work happens inside sealed Chambers where robot arms move the wafers from one processing station to another.

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绿色的“非金属添加工具（metal free tool）”标志意味着硅晶圆必须得经过这台机器的处理以后，才能去添加铜质电路。

The green "metal free tool" sign indicates that this machine is used in a part of the process prior to the addition of copper circuits.

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