... 面字符非撞击打印技术 face character nonimpact printing technique 面芯片 face chip 面色数 face chromatic number ...
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另一面，芯片制造商也日益依赖于其它经济方面的健康状态。
The flip side is that chipmakers have come to depend increasingly on the health of the rest of the economy.
它们可以分为圆片级封装、芯片级封装、和封装面。
They can be classified into wafer level, chip level, and package level stacking.
组合材料芯片技术是用一系列掩膜在同一块基片上获得含不同参数单元样品面阵的方法。
Combinatorial material chip technology provides a new way to fabricate multi-element arrays with different parameters on the same substrate by using a series of masks.
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