介绍了研究集成电路互连线电迁移的两种方法：加速寿命试验和移动速度试验。
Two main methods, accelerated lifetime test and drift velocity test, to study electromigration are described.
在一个集成电路中，多个芯片、共享内存以及互连形成了一个紧密集成的多处理核心(参见图4)。
On a single integrated circuit, multiple chips, Shared memory, and an interconnect form a tightly integrated core for multiprocessing (see Figure 4).
深亚微米集成电路的互连线延迟是设计中需十分重视并必须解决的问题。
Interconnect wire delay is a very important question that must to be resolved in deep submicron IC design.
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