铜箔是一种阴质性电解材料，沉淀于电路板基底层上的一层薄的、连续的金属箔， 它作为PCB的导电体。它容易粘合于绝缘层，接受印刷保护层，腐蚀后形成电路图样。
TB2/Cu/TB2扩散焊的界面反应 - 中南大学学报（自然科学版、英文版） 关键字: 钛合金；铜箔；扩散焊；界面[gap=871]Key words: titanium alloys; copper foils; diffusion welding; interface
基于2751个网页-相关网页
压延铜箔 (Wrought Copper Foil)是将铜板多次辊轧形成的铜箔. 压延铜箔的延展性柔韧性优于电解铜 箔,但成本高,大多用于挠性印制板.
基于16个网页-相关网页
铜箔面 copper-clad surface ; clad surface ; Copper side ; copper-clad su ce
铜箔基板 CCL ; copper claded laminates ; Copper Film ; copper-clad laminate
压延铜箔 ROLLED COPPER FOIL ; RA Foil ; rolled-wrought copper Foil ; Wrought Foil
薄铜箔 thin copper foil ; ultra thin copper foil ; thellon copper foil
去铜箔面 foil removal surface ; foil removal su ce
退火铜箔 annealed copper foil
软性铜箔基板 FCCL ; Flexible Copper Clad Laminate
涂胶铜箔 adhesive coated foil
涂胶脂铜箔 resin coated copper foil
When the thickness of copper layer is over some value, the electric ability of wood surface is close to that of copper foil and the adhesive intensity is also been improved.4.
当达到一定的厚度时,木材表面铜层的导电性能够接近于铜箔的导电性;同时,随着厚度的增加,镀铜层在木材表面的附着强度也有很大的提高。
参考来源 - 木材非电解镀铜工艺及其镀层表征·2,447,543篇论文数据，部分数据来源于NoteExpress
去毛刺-钻孔后会在铜箔和孔壁上产生粗糙边。
Deburring As drill removes copper a small copper ridge forms around the hole edge.
零件密集区之PCB（下有铜箔层），为板温量测点。
PCB with highly concentrated component, ( bottom is copper tinsel) that is the absolute point of measurement.
介绍了覆铜箔板纸的用途，覆铜箔板的制造过程和应用。
The manufacturing process and application of the printed circuit board paper are briefly introduced in this paper.
应用推荐