锂离子电池铜箔负极集流器的最新开发。
Recent Developments in Cu Foil as a Current Collector of Li-ion Battery.
去毛刺-钻孔后会在铜箔和孔壁上产生粗糙边。
Deburring As drill removes copper a small copper ridge forms around the hole edge.
该锌-镍合金作为印制板用压延铜箔的阻挡层。
The alloy coating obtained is used as the barrier layer of wrought rolled copper foil in PCB manufacturing.
介绍了提高铜箔粗化度及加强碳黑分散的工艺措施。
The technical measures to improve roughness copper foil and strengthen dispersion of carbon black were introduced.
零件密集区之PCB（下有铜箔层），为板温量测点。
PCB with highly concentrated component, ( bottom is copper tinsel) that is the absolute point of measurement.
金箔可分为真金箔、仿金箔，另外还有铜箔、铝箔等。
Gold can be divided into real gold leaf, imitation gold leaf, in addition to copper, aluminum and the like.
介绍了覆铜箔板纸的用途，覆铜箔板的制造过程和应用。
The manufacturing process and application of the printed circuit board paper are briefly introduced in this paper.
它包括覆铜箔板非导磁基材、覆铜箔线圈和非导磁材料板。
It includes non - magnetizer basis material covered by copper film, winding covered by copper film and non-magnetizer material board.
研究了阴极辊焊缝处组织与电解铜箔表面上形成的光亮带之间的关系。
The relationship of the welding seam microstructure of the drum cathode and the light region forming on the copper foil surface was studied.
通过对焊接工艺参数进行精密控制，实现了铜箔漆包线的单面直接焊接。
Through precise control of welding process parameters, one-side welding enameled wire to copper foil is realized.
经过处理后的电解铜箔耐蚀性、耐热性和粘合强度等性能指标均有明显提高。
After the plating, corrosion resistance, heat resistance and binding strength of electrolyte copper foil were improved.
已经解决了这个问题，传单宣称相机周围的铜箔屏蔽是一个简单的补救措施。
Flyers that have tackled this issue claim that a copper foil shield around the camera is an easy remedy.
该文简要地介绍了电解铜箔生产的溶铜工艺过程中多项反应的物理化学过程。
This paper brief introduces the Physical chemistry process of heterogeneous response in the technical process of copper dissolved for produced process of electrodeposited copper foil.
文章介绍了在电解铜箔的生长过程中所产生的废水回收再利用的新技术成果。
This paper introduces new technical achievement for waster water reutilization in electrodeposited copper foil production process.
对钻孔精确度，孔径，孔数量，孔位与铜箔表面确认，是否有相应的检验程序？
Is there a general inspection procedure with Drilling accuracy Hole size Hole quantity Hole location and Copper surface appearance defined?
其纵向截面自下而上依次是非导磁材料板、覆铜箔线圈、覆铜箔板非导磁基材。
Its lengthways section from from the top down are non-magnetizer material board, winding covered by copper film and non - magnetizer basis material covered by copper film.
介绍了铜箔在变压器应用的现状，概述了箔式绕组变压器的种类、特点及经济性。
The situation of the copper foil applied to transformers is introduced. The economy, characteristics and types of the transformer with foil windings are presented.
美国耶兹铜箔公司创始于1955年，是全世界第一家制造电路板的电解铜箔厂。
Set up in 1955, Yates foil USA, Inc. was the first company in the world manufactures electrodeposited copper foil for Print Circuit Boards industry.
从原材料的角度，研究了制作DC B板所使用的铜箔和陶瓷材料对其性能的影响。
From the view of the raw materials used for manufacturing DCB plate, the influence of copper foil and ceramic material on the properties of DCB is studied.
但一些科学家仍致力于改进借助过渡金属基质的石墨烯生产方法，比如说借助铜箔基板。
A number of scientists, yet, are focussing on the improvement of graphene growth over transition metal substrate such as copper foil substrate.
从零件放置、布线和补铜箔等三个方面讨论了在双面印制板设计中如何控制电磁干扰。
The paper discusses how to control the EMI in designing twolayer PCB at three points:part placement, routing and copper pour.
测量网格是由康铜箔片构成的，然后完全密封于一个由聚酰亚胺薄膜组成的介质载体。
The measuring grid is formed by etching Constantan foil, which is then completely sealed in a carrier medium composed of polyimide film.
采用电镀法在铜箔上制得了金属锡电极，用作锂离子蓄电池阳极材料进行了电化学测试。
The metal tin electrodeposited on cupper foil was used as anode material of lithium-ion batteries.
电子屏蔽材料、PVC 、胶片、麦拉纸、铜箔、铝箔、泡棉等多种绝缘材料。
Various insulating materials as electronic shield materials, PVC, film, Mylar , copper foil . aluminum foil, foam, ect.
蒂凡尼款式的灯被认可，与众不同的彩色玻璃灯罩，使用铜箔与彩色玻璃的展品焊接在一起。
A Tiffany style lamp will be recognized by the distinctive stained glass shade, made with pieces of stained glass soldered together using copper foil.
铜箔和黄铜板都有脱锌腐蚀的现象发生，铜箔在酸性气体中的腐蚀程度比黄铜板要严重的多。
Both copper foil and brass plate have the phenomenon of dezincification, the copper foil had more serious corrosion than brass plate than in the acid environment.
覆铜箔层压板原纸的研究与生产，对造纸业改变产品结构，提高经济效益有着较大的现实意义。
The research and production of copper foil board base paper not only changes the construction of the production in papermaking industry, but also increases the economical benefit.
覆铜箔层压板原纸的研究与生产，对造纸业改变产品结构，提高经济效益有着较大的现实意义。
The research and production of copper foil board base paper not only changes the construction of the production in papermaking industry, but also increases the economical benefit.
应用推荐