本发明还提供一种芯片焊接结构。
保证了芯片焊接的准确性。
The probe had greatly improved the accuracy for chip welding.
本文介绍作者设计的高速芯片焊接机焊头的独特结构和工作原理，并给出了主要设计参数和计算公式。
This paper introduces the original struchure and principle of the bondhead device for high speed die bonder designed by author.
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