本文介绍作者设计的高速芯片焊接机焊头的独特结构和工作原理，并给出了主要设计参数和计算公式。

This paper introduces the original struchure and principle of the bondhead device for high speed die bonder designed by author.

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超声铝丝焊接机和超声金丝球焊接机主要运用于半导体生产后工序中芯片焊盘与外框架间引线的焊接。

Ultrasonic aluminum wire bonder and ultrasonic gold wire bonder are mainly applied to joint the chip pad with the lead-frame in the later process of semiconductor producing.

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通过激光微焊接机理的研究，得出脉冲激光更适合MEMS芯片的焊接封装。

The mechanism of laser jointing was studied, and the conclusion that impulse laser is even more the same with MEMS encapsulation was duced.

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