AD 7812也提供三种封装：20引脚、0.3英寸宽、小型塑料双列直插式封装(小型DIP)； 20引脚、小形集成封装(SOIC)；以及20引脚超薄紧缩小型封装(TSSOP)。

The AD7812 is available in a small, 20-lead 0.3 "wide, plastic dual-in-line package (mini-DIP), in a 20-lead, small outline IC (SOIC) and in a 20-lead, Thin Shrink small outline package (TSSOP)."

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针对超高频机载合成孔径雷达天线小型化、高增益和宽频带的问题，分析了短背射天线缩小背腔的增益损失。

To meet the requirements of miniaturization, high gain and wideband of UHF antenna for aircraft SAR, the gain loss produced by narrowing back cavity of short back radiation antenna is analyzed.

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散热性好，利用FPC可大大缩小装置的体积，使装置实现小型化、轻量化、薄型化。

Heat, good use of FPC can greatly reduce the size of devices to enable devices to achieve small, lightweight, thinner.

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