AD 7812也提供三种封装：20引脚、0.3英寸宽、小型塑料双列直插式封装(小型DIP)； 20引脚、小形集成封装(SOIC)；以及20引脚超薄紧缩小型封装(TSSOP)。
The AD7812 is available in a small, 20-lead 0.3 "wide, plastic dual-in-line package (mini-DIP), in a 20-lead, small outline IC (SOIC) and in a 20-lead, Thin Shrink small outline package (TSSOP)."
针对超高频机载合成孔径雷达天线小型化、高增益和宽频带的问题，分析了短背射天线缩小背腔的增益损失。
To meet the requirements of miniaturization, high gain and wideband of UHF antenna for aircraft SAR, the gain loss produced by narrowing back cavity of short back radiation antenna is analyzed.
散热性好，利用FPC可大大缩小装置的体积，使装置实现小型化、轻量化、薄型化。
Heat, good use of FPC can greatly reduce the size of devices to enable devices to achieve small, lightweight, thinner.
树脂封装能缩小器件尺寸、减轻重量、降低成本、促进小型化。
Resin package is be used to decrease size of device, diminish weight, reduce costs and push for miniature.
因此许多科研机构想通过缩小光学系统部位从而使整个系统达到轻量化与小型化。
So many scientists want to reduce the optical system parts in order to make the whole system the lighter weight and further miniaturization.
因此许多科研机构想通过缩小光学系统部位从而使整个系统达到轻量化与小型化。
So many scientists want to reduce the optical system parts in order to make the whole system the lighter weight and further miniaturization.
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