【Key words】 photodetection； correlation detection； information processing； silicon microsensor；
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本文评述的混合光纤传感器类型范围涉及：电源驱动、光源驱动、硅微技术。
This paper refer hybrid sensor types to activation of power supply, activation of light source, silicon microtechnology.
本文研制的体硅工艺微振动传感器，其敏感单元为叉指电极结构，弹性梁采用新颖的多级折梁结构。
The sensing element of the bulk machining vibration sensors is consisted of comb electrodes, and its elastic beams are novel multi-folding beams.
对硅基锆钛酸铅(PZT)压电薄膜微传感器进行了结构和版图设计。
The structural and territorial design of PZT thin film micro-sensors is processed.
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