本文制备湿固型MDI- 聚醚基聚氨酯热熔胶，研究了MDI-聚醚预聚物结构、增粘树脂等对胶粘剂剥离强度的影响。
The hot-melt moisture cure PU adhesives have been prepared. The effects of the structure of the MDI-polyether prepolymer, tackify resins on peel strength of the adhesives have been studied.
DOVER系列低温固化胶是单组份、低温热固化改良型环氧树脂胶粘剂。
DOVER series low temperature curing adhesives are one part, low temperature heat curable epoxy.
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