本文制备湿固型MDI- 聚醚基聚氨酯热熔胶,研究了MDI-聚醚预聚物结构、增粘树脂等对胶粘剂剥离强度的影响。
The hot-melt moisture cure PU adhesives have been prepared. The effects of the structure of the MDI-polyether prepolymer, tackify resins on peel strength of the adhesives have been studied.
DOVER系列低温固化胶是单组份、低温热固化改良型环氧树脂胶粘剂。
DOVER series low temperature curing adhesives are one part, low temperature heat curable epoxy.
DOVER系列低温固化胶是单组份、低温热固化改良型环氧树脂胶粘剂。
DOVER series low temperature curing adhesives are one part, low temperature heat curable epoxy.
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