此外，他在底部填充胶和粘接剂方面有着丰富的经验。
In addition, he also has very extensive experience in the development of underfills and adhesives.
基 板上的倒装芯片一般采用底部填充技术以提高其封装的可靠性。
Underfill technology effectively enhances the flip-chip cycle fatigue life and reliability of packaging process.
包装篮总结每一个丰富多彩的礼品包装礼物。把一个丝对篮子底部填充纸层。
Place the gift basket in the center of a large piece of tulle netting, wrap all the content inside the netting, and tie it off with a ribbon.
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