...料的廓张Solder bump(焊锡球)：球状的焊锡材料粘合在无源或者有源元件的接触区，起到与电路焊盘毗连的效用Solderability(可焊性)：为了形成很强的毗连，导体(引脚、焊盘或者迹线)熔湿的(变成可烧焊的)能力Soldermask(阻焊)：印刷电路板的处置惩罚技术，除开要...
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双金属排气阀的电子束焊接-加工工艺-机电之家网加工工艺栏目 关键词:排气阀;电子束焊接;可焊性 [gap=734]Key words: exhaust valve spindle;electric beam welding;weldability
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... welding cam (触及对于焊机的)增大压力凸轮 welding capacity可焊性 welding characteristics烧焊特征 ...
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... 焊盘拉脱强度Pull of Strength of Peels 可焊性Sloder Ability 翘曲度Bow and Twist ...
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可焊性试验 solderability test ; weldability test
可焊性测试 Solderability
引线可焊性 wire bondability
局部可焊性 local weldability
有机可焊性保护膜 OSP ; organic solderability preservative
可焊性测试仪 solderability checker ; solderability tester ; Solder Checker
综合可焊性 overall weldability
钢筋可焊性 weldability of steel bar
工艺可焊性 operative weldability ; fabrication weldability
Electroless nickel of low-phosphorous coatings have been widely applied in electronic fields because of its great solderability.
低磷化学镀镍因其优异的可焊性而被广泛的应用在电子领域。
参考来源 - 低磷化学镀镍工艺的研究·2,447,543篇论文数据，部分数据来源于NoteExpress
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