盲孔或通孔的属化制程也是直接用电镀的方式完成。
The matellization process of blind via or though hole is also achieved by means of copper electroplating.
在半虚拟化中，控制程序实现了管理程序的应用程序接口(API)，它将由来宾操作系统使用。
In paravirtualization, the control program implements a hypervisor application program interface (API) that is used by the guest operating system.
是否针对这些在用制程有书面化的程序规范？
Is there a written process specification for all active processes?
应用推荐