LED chips for communication 发光二极体晶片 ; 晶粒 ; 发光二极体晶片﹛晶粒
LED chips not for communication 发光二极体晶片 ; 晶粒 ; 发光二极体晶片﹛晶粒
more LED chips 多芯片LED
led chips not for co 发光二极体晶片
LED Chips for 发光二极体晶片
LED chips test LED芯片检测
The wafers are used by our customers to fabricate into LED devices (LED chips).
客户用我们的外延片来生产LED芯片。
The defective and damaged LED chips appearing in the production process were analyzed and classified.
对LED芯片生产过程中出现的缺陷和损坏现象进行了分析和归类。
The invention relates to a packaging method for flip LED chips, which belongs to the field of LED fabrication.
本发明涉及一种倒装led芯片的封装方法，属于LED制造领域。
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