... 发光二极体晶圆(非通信用) LED Wafers not for 发光二极体晶片、晶粒(通信用) LED Chips for 发光二极体晶片、晶粒(非通信用) LED Chips not for ...
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LED chips for communication 发光二极体晶片 ; 晶粒 ; 发光二极体晶片﹛晶粒
LED chips not for communication 发光二极体晶片 ; 晶粒 ; 发光二极体晶片﹛晶粒
led chips not for co 发光二极体晶片
LED Chips not for 发光二极体晶片
The noise power spectra of the non-contact detection system for LED chips and the noise suppression methods are discussed.
分析了LED芯片非接触检测系统噪声信号的功率谱，研究了噪声信号的抑制方法。
The invention relates to a packaging method for flip LED chips, which belongs to the field of LED fabrication.
本发明涉及一种倒装led芯片的封装方法，属于LED制造领域。
Company's main products include high power white, blue and green LED epi wafers and chips for the back lighting application of laptop and LCD TV and general lighting.
公司主要产品包括高功率白色，蓝色、绿色和紫色发光二极管外延片和芯片可应用于笔记本电脑和液晶电视的背光源照明及普通照明。
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