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solder joint reliability 添加释义

网络释义专业释义

  焊点可靠性

...,主板主要元器件变得更小,速度越快,精密度更高,同时无铅焊接技术的全面引入给主板的焊点可靠性Solder Joint Reliability)带来更大的挑战。

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  点可靠度

...手机等;所以近年来一直是电子封装业界注目的焦点,因此也衍生出封装产品组装到电路板上的焊点可靠度(Solder Joint Reliability)问题。

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  焊点可靠度

。 所以近年來一直是電子封裝業界注目的焦點,因此也衍生出封裝產品組裝到電路板上的焊點可靠度(Solder Joint Reliability) 問題。 因此工業技術研究院墨 i構裝中心(ITRI …

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短语

Solder joint reliability test 焊点可靠性测试

  • 焊点可靠性 - 引用次数:7

    The results show that the lesser elasticity module and Coefficient of Thermal Expansion can availably reduce thermal stress, affect the package warpage and the solder joint reliability are the substrate thickness and the die thickness.

    计算结果表明,采用较小的弹性模量和热膨胀率的材料可以有效地减小热应力;基板和芯片的厚度是影响封装体热变形和焊点可靠性的主要因素。

    参考来源 - 集成电路芯片封装的热—结构数值模拟分析及优化设计

·2,447,543篇论文数据,部分数据来源于NoteExpress

双语例句

  • SMT solder joint reliability issues caused by drop impact are received more and more attention in recent years.

    随着微电子封装密度的提高,板级封装跌落冲击载荷可靠性成为人们关注的焦点。

    www.dictall.com

  • Research progress of lead-free solder, invalidation models of solder joint, solder joint reliability evaluation and the defects of solder joints in recent years have been reviewed.

    笔者就近年来国内外开发无铅焊料焊点失效模式焊点可靠性评价方法焊点主要缺陷进行了综述

    dict.cnki.net

  • SMT solder joint reliability issues caused by drop impact are received more and more attention in recent years. Research results of theories and experiments in this field are summarized.

    针对跌落碰撞条件下便携式电子产品中S MT 连接焊点可靠性问题领域相关理论实验研究成果进行了综述

    www.chemyq.com

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