• SMT solder joint reliability issues caused by drop impact are received more and more attention in recent years.

    随着微电子封装密度的提高,板级封装跌落冲击载荷可靠性成为人们关注的焦点。

    www.dictall.com

  • Research progress of lead-free solder, invalidation models of solder joint, solder joint reliability evaluation and the defects of solder joints in recent years have been reviewed.

    笔者就近年来国内外开发无铅焊料焊点失效模式焊点可靠性评价方法焊点主要缺陷进行了综述

    dict.cnki.net

  • SMT solder joint reliability issues caused by drop impact are received more and more attention in recent years. Research results of theories and experiments in this field are summarized.

    针对跌落碰撞条件下便携式电子产品中SMT连接焊点可靠性问题领域相关理论实验研究成果进行了综述

    www.chemyq.com

  • With the change of material and technics in electronic packaging, it brings the problem of solder joint reliability.

    电子封装高度集成化,使得焊点可靠性评估更加困难,而封装无铅化,又焊点可靠性研究带来新的问题

    www.dictall.com

  • In the SMT field, and the solder joints act as mechanical connect and electronic link between electronic components and PCB, so solder joint reliability has been a great concern.

    SMT中,焊点电气连接机械连接的双重作用SMT焊点可靠性人们长期关注的最关键问题之一。

    danci.911cha.com

  • The quality of solder joint affects the reliability of the products produced by SMT directly.

    表面组装技术(SMT形成产品,其焊点质量直接影响产品可靠性

    www.dictall.com

  • So it is necessary to study lead-free solder joint's reliability under cyclic stretch and impact.

    循环拉伸好的模拟实际的振动,因此研究循环拉伸载荷焊点可靠性是很必要的。

    www.dictall.com

  • The orthogonal experiment design method was applied to study the relationships between solder joint process parameters and reliability of plastic ball grid array (PBGA) component.

    基于正交试验设计塑封阵列PBGA器件焊点工艺参数可靠性关系进行了研究

    www.dictall.com

  • It should be payed much attention to fast cooling because it can decrease the defects of PCB assemblies and promote the reliability of solder joint.

    研究现状表明快速冷却有助于减少焊接缺陷提高焊点可靠性

    www.chemyq.com

  • So the drop impact reliability of solder joint is the key content of unleaded portable electronic products.

    因此焊点跌落可靠性无铅便携式电子产品可靠性关键内容

    www.fabiao.net

  • The reliability of solder interconnection joint is one focal subject in the development of microelectronics packaging and assembly technology.

    互连焊点可靠性微电子封装组装技术发展受到普遍关注课题

    danci.911cha.com

  • The evolving parameters of SMT solder joint is directly related with the reliability of the solder joint.

    焊点形态参数直接影响SMT焊点可靠性

    www.chemyq.com

  • The reliability of the solder joint decides the quality and development of electronic production. In fact, heat action is the main reason for the failure of electronic package.

    焊点可靠性问题是电子封装技术领域亟待解决重要课题,决定电子产品质量发展基本问题。

    www.fabiao.net

  • Therefore, it is necessary to study the reliability of this mixed solder joint.

    因此必要这种混合焊点进行可靠性分析

    www.dictall.com

  • Analyse the failure modes and mechanism of the mixed solder joint, and introduce the effect factors of reliability ulteriorly.

    混合焊点失效形式混合焊点失效机理进行了分析进一步介绍影响焊点可靠性因素

    www.chemyq.com

  • Here recent achievements on the lead-free solder were presented in view of joint manufacturing and structural reliability.

    本文焊料焊接结构可靠性等方面介绍了近年国内外无铅焊料研究方面的最新成果

    dict.cnki.net

  • During the course of SMT production, if the quality of solder joint can be evaluated and controlled in real-time, the productivity of SMT and the reliability of products can be improved accordingly.

    SMT产品生产过程如果能够焊点质量进行实时评价控制提高生产率产品可靠性

    dict.cnki.net

  • For increased reliability, a reduced CTE (coefficient of thermal expansion) mismatch with the PCB reduces the possibility of solder-joint cracks resulting from thermal cycles.

    提高可靠性降低热膨胀系数热膨胀系数不匹配PCB减少循环所得焊点裂缝可能性

    products.eccn.com

  • For increased reliability, a reduced CTE (coefficient of thermal expansion) mismatch with the PCB reduces the possibility of solder-joint cracks resulting from thermal cycles.

    提高可靠性降低热膨胀系数热膨胀系数不匹配PCB减少循环所得焊点裂缝可能性

    products.eccn.com

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