...可键合性;可靠性;超声键合;优化工艺条件 [gap=9392]Keywords: wire bonding; bond ability; reliability; Ultrasonic Bonding; optimum Conditions...
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The frequency spectrums of force response were obtained through output force signals of dynamic force sensor. These experiment phenomena and results are helpful to studied on bonding parameters matching and optimization in ultrasonic bonding.
利用压力传感器输出压力响应信号,得到压力响应曲线的频谱图,实验分析键合压力参数对超声功率参数的匹配,对今后超声键合过程参数的匹配及优化具有一定的指导意义。
参考来源 - TS2100超声键合机换能系统俯仰振动实验研究So the study of the ultrasonic bonding is significant. The aim of the investigation is to optimize the ultrasonic processing parameters and supply the experiment data.
本课题研究的目的在于通过具体的试验为超声键合机理理论研究提供必要数据,为实际生产提供优化参数。
参考来源 - 电子器件超声键合接合部形成特征及电性能研究·2,447,543篇论文数据,部分数据来源于NoteExpress
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