在超声引线键合过程中,键合力是影响键合强度的重要因素之一。
In ultrasonic wire bonding process, the bonding pressure is one of the most important factors to the bonding strength.
在超声引线键合过程中,键合压力是影响键合强度的重要因素之一。
The characteristics of bonding force in the ultrasonic bonding process were also studied.
粗铝丝超声引线键合;换能器驱动电流;信号时频分析;特征提取;质量在线监测。
Aluminum wire ultrasonic bonding; transducer drive current; signal time-frequency analysis; feature selecting; quality online monitoring.
应用推荐