(1)表面蚀刻(direct etching) 在crt表面蚀刻出许多微小的凹坑，可以形成对环境光线的漫反射，从而达到减低反射光强度、减少环境光干扰的目的。
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现代的微处理器需要十亿美元的被称为 fab 的工厂，以在其表面蚀刻出使其得以运作的微型电子元器件。
A modern microprocessor requires a billion-dollar plant called a fab to etch onto its surface the tiny electronic components that make it run.
然后，在猫眼石结构表面用电沉积法镀上一层镍膜，之后把猫眼石蚀刻掉，再经过电解抛光，增加这些镍膜空隙度。
After that, a layer of nickel was electrodeposited on the opal, which was then etched away. The porosity of the nickel layer was then increased using electropolishing.
例如，在纸张，木头或纸板的蚀刻会出现如碳化(燃烧)，而金属表面可能会融化。
For example, on paper, wood or cardboard the etching would occur as carbonization (burning) while the surface of a metal might be melted.
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