整个设计具有革新性，并采用独特的技术和简洁、高性能的炉组件。

This fully integrated design USES an innovative, unique technology in a compact powerful furnace module.

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此外，利用有限元ansys软件对PC B组件在整个红外再流焊炉中的焊接过程建立了实体模型，进行了PC B组件再流焊全过程的三维动态模拟和仿真。

Furthermore, the soldering process of PCBA in the whole infrared reflow soldering stove is modeled by the finite element software, ANSYS, and is simulated by the three-dimensional modelling.

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