整个设计具有革新性，并采用独特的技术和简洁、高性能的炉组件。
This fully integrated design USES an innovative, unique technology in a compact powerful furnace module.
此外，利用有限元ansys软件对PC B组件在整个红外再流焊炉中的焊接过程建立了实体模型，进行了PC B组件再流焊全过程的三维动态模拟和仿真。
Furthermore, the soldering process of PCBA in the whole infrared reflow soldering stove is modeled by the finite element software, ANSYS, and is simulated by the three-dimensional modelling.
此外，利用有限元ansys软件对PC B组件在整个红外再流焊炉中的焊接过程建立了实体模型，进行了PC B组件再流焊全过程的三维动态模拟和仿真。
Furthermore, the soldering process of PCBA in the whole infrared reflow soldering stove is modeled by the finite element software, ANSYS, and is simulated by the three-dimensional modelling.
应用推荐