利用有限元法研究了堆叠芯片封装(SCSP)器件在封装工艺过程中的热应力分布。
The thermal stress distribution of SCSP in packaging process was studied by finite element method.
另外，如今的趋势是把芯片堆叠到一起，提高芯片之间的通讯效率。
Moreover, the trend is to stack chips on top of one another, to improve communications between them.
在冲向这堵墙的过程中，为了保持速度，通过把集成电路堆叠起来增加密度，闪存业已开始制造三维芯片。
To keep up speed on the way to the wall, the industry has begun building three-dimensionalchips by stacking circuits on topof one another to increase densities.
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