We have to face some Cu line issues after we use Cu to replace AL, such as the reliability with Cu and low K dielectric, and post-CMP (Chemical Mechanical Polishing) Cu line voids defect.
在引入电镀铜工艺的同时我们也不得不面对一些铜线工艺所特有的缺陷，如铜线和低K值介电质可靠性问题，以及电镀铜后产生的孔洞缺陷等问题。
The results show that the signal processing method can judge the endpoint of the Cu CMP process.
试验结果表明，该信号处理方法可以判断出铜CMP过程的终点。
The resistance and stress of Cu film will be studied by different rotation speeds, anneal process and queue time (ECP to CMP).
通过对比电镀铜工艺中不同的转速对孔洞缺陷的影响，得到电镀时转速与孔洞缺陷的关系；
应用推荐