...非平面状(IT-弦状或胞状),增加了沿非平面状界面上的金属一金属之间的接触面积;将残留的难熔氧化物粒子在接合线(bond line)上分布由传统TLP工艺下的平直状改善为正弦状或胞状分布。
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The result shows that the bond between surfacing weld and base metal is metallurgical bond, and bond line is clear.
结果表明,喷焊层与基体是冶金结合,结合线清晰。
In welding test of TCS stainless steel, it was found that impact absorbing energy of heat-affected zone (HAZ) near bond line in welded joint was low.
在TCS不锈钢前期焊接试验中发现其焊接接头热影响区的冲击吸收功值在熔合线附近较低,原因是接头热影响区晶粒粗大所致。
Some pores appeared mainly near in the bond line, but porosity can be suppressed to a great extent by increasing welding speed or electron beam scanning.
结果表明,在保证试件完全焊透的情况下,降低电子束的线能量,可在一定程度上提高接头的强度;
So we have h, then we can draw our bond as a line.
那么我们有氢,可以把我们的键画成一条线。
But since in drawing Lewis structures actually, in some cases you do, you can draw a dotted line that means a 1 and 1/2 bond, but most in most cases, we just draw out both resonance structures, and the way that we say it's a resonance structure is that we put it in the brackets and we put an arrow between it.
但是由于在画路易斯结构时,其实,在某些情况下是可以的,你可以画一条虚线来表示一又二分之一键,但是在多数情况下,我们就把两个结构都画出来,而我们说这是一个共振结构的表示的方法是,把它们放在括号里,并在中间放一个双箭头。
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