以自制的锡银铜系焊粉为基础制备焊膏并做焊接模拟。
Take the powder of tin, silver and copper solder as the basis to make solder paste and simulate soldering.
本发明涉及一种铜颗粒增强型锡银锌复合焊料及其制备方法。
The invention relates to a copper particle reinforced type tin, silver and zinc composite solder and the preparation method.
本发明涉及一种碳化硅颗粒增强型锡银锌复合焊料及其制备方法。
The invention relates to a silicon carbide particle reinforced type tin, silver and zinc composite solder and the preparation method.
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