另外，如今的趋势是把芯片堆叠到一起，提高芯片之间的通讯效率。
Moreover, the trend is to stack chips on top of one another, to improve communications between them.
文章介绍了芯片堆叠和封装堆叠的优缺点、关键技术、最新动态和发展前景。
In this paper, the merits and demerits, the key technology, the recent development and the developmental prospects for chip stacking and package stacking are introduced.
而现在，多家组织已经组建了许多新的，面向主流应用的3D芯片堆叠项目组。
Right now, there are several new and mainstream 3-D chip projects in the works.
在冲向这堵墙的过程中，为了保持速度，通过把集成电路堆叠起来增加密度，闪存业已开始制造三维芯片。
To keep up speed on the way to the wall, the industry has begun building three-dimensionalchips by stacking circuits on topof one another to increase densities.
阐述了MEMS的主要封装工艺和技术，包括圆片级封装、单芯片封装、多芯片组件和3d堆叠式封装等。
Moreover, some major processes package of MEMS, including wafer-level packaging, single-chip packaging, multi-chip packaging and stacked 3d packaging, etc were discussed.
客户经常提到的问题是，你能在一个堆叠结构内成像多少芯片？
The question most often asked is, How many die can you image in one stack?
第二芯片配置于承载器上，并与第一芯片相堆叠。
The second chip is arranged on the loader and is stacked with the first chip.
利用有限元法研究了堆叠芯片封装(SCSP)器件在封装工艺过程中的热应力分布。
The thermal stress distribution of SCSP in packaging process was studied by finite element method.
针对第一种堆叠方式，修改了VINETIC芯片的驱动程序，使之能够同时支持多块芯片；
Targeting the first stacked design, we modified the VINETIC Chip's driver, to enable them supporting multi-block chips;
针对第一种堆叠方式，修改了VINETIC芯片的驱动程序，使之能够同时支持多块芯片；
Targeting the first stacked design, we modified the VINETIC Chip's driver, to enable them supporting multi-block chips;
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