是否对焊膏的有效期进行控制？
是否对存放焊膏的电冰箱温度进行控制？
Is the storage fridge temperature of Solder Paste controlled?
主要介绍了提高焊膏印刷质量的一般要求。
The article introduces the general requirements to improve the quality of stencil printing.
使用前将焊膏搅拌均匀，倒入合金粉搅拌。
Stir before using the paste, stirring into the alloy powder.
概述了低熔点和高熔点型无铅焊膏的开发动向。
This paper describes the development trend of low melting point and high melting point type Lead-free solder paste.
本产品是免清洗焊膏，几乎无残留，无需清洗。
This product is no-clean solder paste, very little residue, no cleaning.
焊膏是否搅拌使用？
系统研究了焊料尺寸分布对焊膏流变行为的影响。
The effect of particle size distributions on rheological properties is investigated.
以自制的锡银铜系焊粉为基础制备焊膏并做焊接模拟。
Take the powder of tin, silver and copper solder as the basis to make solder paste and simulate soldering.
本公司生产的有铅锡膏已采用符合无铅要求的助焊膏。
Soldering flux meeting the lead-free requirements is used for the lead-containing solder paste manufactured by our company.
具有焊膏放置几何形状检查和测量装置的满视觉丝印。
Full vision screen-printing with solder paste placement geometry inspection and measurement equipment.
在电子装联技术中，焊膏印刷的效果对产品质量关系极大。
In the surface mounting technology, the result of the solder printing is very big to the product quantity.
彩色银焊膏系列，在保持原有品质上，使焊品更美观更光彩。
Color silver paste series, while maintaining the original quality, so that welding is more beautiful goods more luster.
焊剂和焊膏的各项技术指标均达到JIS- 3197标准。
All technical indexes of the flux and the soldering paste achieve the JIS-3197 standard.
清洗后的零件，以及使用脱脂我“画”一个非常轻层的自我清洗焊膏。
After cleaning the parts well using a degreaser I "painted" on a very light layer of a self cleaning soldering paste.
实验结果表明，松香种类不影响无铅焊膏用松香型助焊剂的助焊性能。
The factors affecting soldering ability of rosin-based flux for lead-free solder paste, and the factors affecting erosion resistance are discussed.
我们制造焊膏所使用的焊锡粉是在惰性气体和严格质量控制之下制成的。
All solder powders that are used for our paste manufacturing are made under inert atmosphere and under tight quality control program.
适量的表面活性剂的加入，有助于增强无铅焊膏用松香型助焊剂的助焊性能；
The result is that the rosin kind has no effect on soldering ability of rosin-based flux.
重点介绍了激光切割成型的模版、锡焊膏的特点及丝网印刷中应注意的问题。
The paper introduces the laser cut mould plate, the characteristics of tin solder and some problems which should be paid attention to in screen printing.
回流焊：应用加热金属涂敷层的表面和预涂焊膏，熔融，连接和凝固两个金属涂层。
Reflow Soldering: Melting, joining and solidification of two coated metal layers by application of heat to the surface and predeposited solder paste.
介绍焊膏印刷中影响质量的诸多因素并分析其原因，同时提出部分纠正措施和建议。
Introduce many factors of infecting quality in solder-paste printing process and have analysed those reasons, present some corrective actions and advice at the same time.
BOWE博威供应橱具卫浴行业专用银焊条，银焊丝，低温焊条，银焊粉，银焊膏。
BOWE Broadway bathroom supply kitchenware industry-specific silver electrode, silver wire, low-temperature welding, silver solder powder, silver paste.
本文采用离心分离的方法沉淀出松香型焊膏的无机组分，并用发射光谱测定无机成分；
The inorganic composition of rosin paste was deposited by the way of centrifugation, and determined by the AES.
经表面氧化层处理后，焊料表面粗糙度的降低引起低剪切速率下焊膏粘度的明显升高。
After surface oxide film treatment, the increase of viscosities at low shear rates results from the decrease of surface roughness on the surface of solder powders.
对焊膏的助焊剂活性从润湿力的角度研究导致缺陷的成因，并根据润湿力选择备选焊膏。
The causes for defects from the point of wetting force for the flux activity of solder paste were studied, the solder paste according to the wetting force was selected.
可以确信焊膏喷印将会被更多地应用于电子组装上，成为一种具有竞争力的焊膏印刷技术。
It is believed that JetPrinting will more be adopted in electronics assembly, and will also be a competitive solder-paste printing technology.
文章主要探讨焊膏印刷过程中操作技术要点和应注意的问题，以及一些常见故障的处理方法。
This paper discusses the solder printing process technological key points and the common breakdown problem solution.
在拆除BGA的PCB板焊盘上涂上助焊膏或松香水，用电铬铁将PCB板焊盘上的锡去除；
To smear solder flux paste or colophony on the PCB board of the dismantlement of BGA, remove the tin of welding plate of PCB board with ferrochromium;
在拆除BGA的PCB板焊盘上涂上助焊膏或松香水，用电铬铁将PCB板焊盘上的锡去除；
To smear solder flux paste or colophony on the PCB board of the dismantlement of BGA, remove the tin of welding plate of PCB board with ferrochromium;
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