The snap curing oven is key equipment in the semiconductor packaging.
半导体封装快速养护炉是半导体封装过程中的一个关键设备。
The Trend of IDM Outsource and Opportunities for China Semiconductor Packaging & Testing Companies .
传统的IDM外包趋势与中国半导体封装产业的机遇?。
Transfer molding is widely applied in semiconductor packaging technology by itssuperior in mass production and reliability.
树脂传递模封装是广泛使用的可靠性量产性均好的半导体封装方法。
Semiconductor packaging; Fuzzy Analytic Hierarchy Process (FAHP); Fuzzy Analytic Network Process (FANP); Supplier; Decision analysis.
半导体封装；模糊分析层级程序法； 模糊分析网路程序法；供应商；决策分析。
Global semiconductor packaging materials Outlook is a comprehensive market research study that examines semiconductor packaging technology trends and their impact on the packaging materials markets.
全球半导体封装材料市场展望报告全面调研了半导体封装工艺趋势记忆其对封装材料市场的影响。
Semiconductor equipment, design software and packaging have long been done by separate companies.
半导体设备、设计软件程序包已长期分别由单独的公司来完成。
Its products are routinely used in applications demanding highly precise, controlled movement including: robotics, medical, assembly, semiconductor, packaging, engraving and pick-and-place.
其产品广泛用于需要高精度、运转控制的应用中，包括：机器人、医学、组装、半导体、包装、雕刻和分拣。
Integrated circuit packaging is a backend process of semiconductor industry. Due to the modeling diversification of assembly, process accuracy is required to higher quality.
积体电路封装为整个半导体产业后半段制程，然而封装的型式多样化，相对的制程精准度要求也越来越高。
The simulation results can guide the packaging of the high power semiconductor laser array.
该模拟结果对大功率半导体激光器阵列的封装设计具有现实的指导意义。
The invention provides a lead frame and packaging of a semiconductor device.
本发明提供一种半导体器件的引线框及封装。
This article describes the application of microelectronic plating in manufacture of semiconductor, IC packaging, micro-bumps, multichip modules and microelectronics mechanical systems.
介绍了微电子镀覆在半导体和IC封装、凸点制作、多芯片组件以及微电子机械系统中的应用。
A conductive covering part is attached to the main frame on an external end of an exposed external wall, thus finishing the production of the semiconductor packaged to the packaging.
具有导电性的覆盖件被附着到暴露的外围壁的上端上的主框上，从而完成被封装到封装中的半导体的生产。
The epoxy resin composition can be used for effectively packaging various semiconductor devices, such as transistors and integrating circuits.
本发明所环氧树脂组合物可以有效地用于封装各种类型的半导体器件，如晶体管、集成电路。
He has extensive experience in the fields of semiconductor and electronic packaging, electronic manufacturing, surface finishes and coatings, failure mode analysis and reliability assessment. Dr.
在半导体电子封装，电子制造，表面镀层及涂覆，失效模式分析和可靠性评估方面具有丰富经验。
Moreover, since the columnar bump does not fuse, the distance between a semiconductor board and a packaging board is not be narrowed by solder.
另外，由于柱状块不熔化，半导体线路板和组装线路板之间的距离不因焊料而变窄。
The leadless packaging structure reduces the packaging size of the semiconductor device and reduces the product cost.
本发明缩小了半导体器件的封装尺寸，降低了产品成本。
The leadless packaging structure reduces the packaging size of the semiconductor device and reduces the product cost.
本发明缩小了半导体器件的封装尺寸，降低了产品成本。
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