The snap curing oven is key equipment in the semiconductor packaging.
半导体封装快速养护炉是半导体封装过程中的一个关键设备。
Semiconductor equipment, design software and packaging have long been done by separate companies.
半导体设备、设计软件程序包已长期分别由单独的公司来完成。
The invention provides a lead frame and packaging of a semiconductor device.
本发明提供一种半导体器件的引线框及封装。
The invention provides a lead frame and packaging of a semiconductor device.
本发明提供一种半导体器件的引线框及封装。
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