MMIC on-wafer probe is the key part of MMIC on-wafer measurement system.
MMIC在片测试探头是MMIC在片测试系统的关键部件。
Measures have been discussed for preventing the Al film for being pierced through by the probe in wafer probing on the 1034 Wafer prober.
本文打算在1034探针台上针对如何避免探针扎穿铝层问题作一讨论。
Anisotropic conductive connector, conductive paste composition, probe member, wafer inspection device and wafer inspection method.
各向异性导电连接器，导电浆料成分，探针元件，和晶片检测仪器及晶片检测方法。
Can is equipped with a variety of different frequencies, different wafer size twin probe using;
可配备多种不同频率、不同晶片尺寸的双晶探头使用；
If the Al film on the bond pad is pierced through by the probe in wafer probing, the wire bonding strength and device reliability would be affected.
在芯片测试中，若引线焊盘上的铝层被探针扎穿，就会影响引线键合的牢固性和器件的可靠性。
Anisotropically conductive connector, probe material member, wafer inspection apparatus, and wafer inspection method.
各向异性导电连接器，探针元件，和晶片检测仪器及晶片检测方法。
When configured as a Dual probe system, the 413 also provides measurements of total thickness of the wafer, including substrate thickness and the patterned height thickness.
如果设计成双探针系统，413也可以提供硅片总厚度，包括基板厚度和图案高度厚度的测量；
In this paper, the area contact model of depletion layer width under avalanche breakdown in Si epitaxial wafer by a three-probe method is analysed. The theory accords with experimental results.
本文分析了三探针测试硅外延片中雪崩击穿时耗尽层宽度的面接触模型，理论和实验结果吻合。
In this paper, the area contact model of depletion layer width under avalanche breakdown in Si epitaxial wafer by a three-probe method is analysed. The theory accords with experimental results.
本文分析了三探针测试硅外延片中雪崩击穿时耗尽层宽度的面接触模型，理论和实验结果吻合。
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