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flip chip bonding

flip chip bonder 倒装片接合机;倒装焊接机;倒装芯片接合器

  • The methods of 3d interconnection can be classified into the wire bonding, flip chip, through silicon via (TSV) and film wire technology, whose advantages and disadvantages are analyzed.

    实现3d互连方法分为引线键合倒装芯片通孔薄膜导线等,并对它们的优缺点进行了分析。

    lib.cqvip.com

  • This article presents acid could be used to wash the indium bumps before flip chip bonding, based on indium oxide dissolved in acid.

    利用氧化易于溶于酸性溶液的性质,提出了在倒装焊接之前使用酸性溶液铟柱进行酸洗。

    www.dictall.com

  • This paper introduces the forward trends of flip chip bonding, the essential kinds of bumps, fabrication technology and testing technology about qualities.

    介绍芯片倒装焊重要意义、发展趋势、基本焊球类型制作方法焊球质量的检测技术

    dict.cnki.net

  • With the Doppler laser vibration measurement system, the vibration velocity curves of the flip chip and tool tip were obtained during thermo-sonic flip chip bonding.

    采用多普勒激光振动测量系统获得了热超声倒装键合过程工具末端芯片振动速度曲线

    dict.cnki.net

  • The dynamics of ultrasonic transducer for thermosonic flip chip bonding is investigated.

    研究了热超声倒装合设备核心执行机构——能系统的动力学特性

    www.dictall.com

  • The embedded active chip also can be realized by backside thinning and flip chip bonding.

    通过芯片进行背面减薄倒装连接,可以实现有源芯片的嵌。

    dict.cnki.net

  • This paper talks about the major supporting technologies for MCM package: the Interlinkage of Chips, Flip Chip Bonding, Flip Bonding.

    论文研究了MCM芯片安装互连芯片倒装焊接及其关键支撑技术等内容。

    dict.cnki.net

  • Thedrain saturation current is increased 10% after bonding. To disperse heat of GaNHEMT, this flip chip bonding method seems to be simple and effective.

    实验结果表明,这种改进倒装焊技术可以使HEMT 器件的饱和漏极电流提高10%。

    dict.cnki.net

  • An IC chip is mounted by flip chip or wire bonding or adhesive connection on the face of the metal substrate which has the dielectric coating thereon.

    IC芯片倒装焊接金属线焊接或粘贴连接安装于金属基片介质涂层表面

    www.bogu6688.com

  • An IC chip is mounted by flip chip or wire bonding or adhesive connection on the face of the metal substrate which has the dielectric coating thereon.

    IC芯片倒装焊接金属线焊接或粘贴连接安装于金属基片介质涂层表面

    www.bogu6688.com

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