flip chip bonding 倒装焊接 ; 侧装片接合 ; 倒装焊
ultrasonic flip-chip bonding 超声倒装焊
Direct flip-chip bonding 直接倒装芯片接合
Flip-Chip Bonding Technology 覆晶组装技术
flip-chip-bonding technique 倒装焊技术
Flip-chip-bonding equipment 倒装焊设备
thermosonic flip-chip bonding 热超声倒装键合
The methods of 3d interconnection can be classified into the wire bonding, flip chip, through silicon via (TSV) and film wire technology, whose advantages and disadvantages are analyzed.
将实现3d互连的方法分为引线键合、倒装芯片、硅通孔、薄膜导线等，并对它们的优缺点进行了分析。
This article presents acid could be used to wash the indium bumps before flip chip bonding, based on indium oxide dissolved in acid.
利用氧化铟易于溶于酸性溶液的性质，提出了在倒装焊接之前使用酸性溶液对铟柱进行酸洗。
This paper introduces the forward trends of flip chip bonding, the essential kinds of bumps, fabrication technology and testing technology about qualities.
介绍了芯片倒装焊的重要意义、发展趋势、基本的焊球类型、制作方法及焊球质量的检测技术。
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