It can be used for electroless tin plating on copper substrate in electronic element, surface mounting device and PCB.
结果表明 :该工艺镀液稳定 ,可用于电子元器件以及表面安装器件、印制电路板等铜基上化学镀锡。
It can be used for electroless tin plating on copper substrate in electronic element, surface mounting device and PCB.
结果表明 :该工艺镀液稳定 ,可用于电子元器件以及表面安装器件、印制电路板等铜基上化学镀锡。
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