This study is significant to surface treatment of substrate in electroless deposition.
该研究对于化学镀基底材料的表面处理具有重要意义。
By varying the electroless deposition time, inner diameter of the tube can be controlled.
通过改变化学沉积的时间，管的内径可以调变。
An electroless deposition technique on carbon fiber with higher copper deposition rate and stability was presented.
提出了一种有较高沉铜速率和稳定性的碳纤维化学镀技术。
Copper nanocrystallites were deposited on mechanically polished single crystal silicon (sc-Si) wafers by electroless deposition method.
采用无电镀沉积技术在经过机械抛光的单晶硅衬底上沉积了铜纳米晶。
The effect of rare earth elements such as cerium, lanthanum and yttrium on electroless deposition rate of cobalt-nickel-boron alloy was studied.
研究了稀土元素铈、镧、钇对化学镀钴-镍-硼合金沉积速度的影响。
Main work in the present thesis are shown as follows:1 Au was deposited within the pores of the polycarbonate template membrane using an electroless deposition method.
以聚碳酸酯膜为基底，采用化学沉积法，获得了沉积均匀的金纳米通道。
After purification, oxidization, sensitization, and activation pretreatment, the surface of carbon nanotubes was deposited with Co-P by the electroless deposition method.
碳纳米管经纯化、氧化、敏化、活化预处理后，在碱性镀液中化学镀磁性金属钴磷合金，得到一维纳米复合材料。
An electroless deposition route was employed to incorporate high density palladium nanowire arrays into the pore channels of mesoporous thin films (MTFs) which served as templates.
利用介孔氧化硅薄膜作为模板，通过无电沉积路线在介孔薄膜孔道内合成了高密度钯金属纳米线阵列。
Molecular orbital study was applied to investigate electroless deposition processes, focusing upon reducibility of reductants as well as the effect of catalytic activity of the metal surfaces.
分子轨道研究被应用于非电化学沉积中，主要用于研究还原剂的还原性能和金属表面的催化活性。
A process for through hole plating is reviewed in which conventional electroless copper plating is replaced by deposition of a carbon black-graphite layer.
综述了一种对印制线路板通孔镀的方法，即在孔壁上沉积有电镀用的碳黑—石墨层，以取代传统的化学镀铜工艺。
The main treatment methods of spent electroless nickel plating solution include chemical deposition, catalytic reduction, electrolysis, ionic exchange, etc.
化学镀镍废液的处理方法主要有化学沉淀法、催化还原法、电解法、离子交换法等。
An electroless nickel plating process with high deposition rate was optimized by orthogonal test.
通过正交试验法优选出一种具有高磷含量的快速化学镀镍工艺配方。
On this basis, the acceleration effect of electroless nickel deposition by natrium acetate has been detailed.
在此基础上，系统阐明了乙酸钠对化学镀镍过程的加速作用。
Deposition of metallic nickel on silicon substrate by laser-enhanced electroless plating technique is reported for the first time.
利用激光诱导化学镀技术，首次在硅片上沉积出金属镍。
The latest developed electroless spinel ferrite films plating technology is introduced. The mechanism of deposition is discussed in detail, and applications are illustrated.
介绍了最新的铁氧体磁性薄膜的化学镀技术、沉积机理及其应用。
Preferably, the second metal is coated onto the first metal using electroless Galvanic deposition.
优选地，采用化学镀电流沉积将第二金属涂覆到第一金属上。
The foamed nickel manufactured by electroless and electro-deposition is introduced.
采用化学沉积法和电化学沉积法制备出了泡沫镍。
More attention was focused on the effects of osmosis on the deposition speed, compositions, surface structure properties of the simultaneously deposited Pd-Ag alloy top layer by electroless plating.
重点研究了渗透压对化学镀共沉积钯银的沉积速度、镀层组成和膜表面结构性能的影响。
Quick surface metallization of titania powder was carried out by electroless chemical deposition of nickel.
采用镍的无电子化学沉积方法研究了纳米二氧化钛粉末表面的快速金属化。
Factors affecting stability and deposition rate of electroless Cu are investigated and proper formulation and process for electroless Cu bath determined.
研究了影响化学镀铜镀速和镀液稳定性的诸因素，并根据实验确定了适宜的化学镀铜液配方及其工艺。
The results show that electroless nickel copper phosphorus alloy deposits obtained have improved corrosion resistance, appearance, adhesion, porosity, deposition rate, hardness and wear resistance.
结果表明，所得镍-铜-磷合金镀层的耐蚀性、外观、结合力、孔隙率、沉积速度、硬度和耐磨性等性能优于镍-磷合金及前人制得的镍-铜-磷合金镀层。
Besides, deposition rate of electroless tin also increases with increasing plating time.
若继续升高镀液温度，沉积速率却降低。
The microstructure of electroless copper deposit is greatly effected by the substrate upon which deposition occurs.
化学镀铜层的显微结构受基体的显著影响。
Fabrication methods often include electroless plating, chemical vapor deposition, and sol gel technique, etc.
化学镀法、化学气相沉积法及溶胶凝胶法等。
The replacement deposition method is applied to electroless copper-plating on the magnetic fly-ash powder.
笔者采用置换反应法在粉煤灰空心磁粉表面进行了化学镀铜的研究。
The replacement deposition method is applied to electroless copper-plating on the magnetic fly-ash powder.
笔者采用置换反应法在粉煤灰空心磁粉表面进行了化学镀铜的研究。
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