The process of low temperature wafer direct bonding using wet chemical surface activation methods are discussed.
探讨了使用湿化学法对硅片表面进行活化，完成硅圆片低温直接键合的流程。
As one of the newly-emerged enabling technologies, wafer direct bonding has been playing key roles in more and more fields.
作为半导体制造领域的一项新兴的使能技术，晶圆直接键合已经在越来越多的领域发挥了重要的作用。
The bonding strength of joint zone made by direct and indirect bonding was evaluated and their fracture characteristics were analysed.
对直接连接和间接连接接头的接合强度进行了评估，并对接头断裂特性进行了分析。
Therefore, the direct bonding between the orthodontic bracket and resin composite becomes a universal focus in orthodontic clinicians.
因此，正畸托槽与复合树脂修复体的直接黏结成为临床医师普遍关注的问题。
Bracket direct bonding technique was used on 12 of the patients (220 teeth) randomly. The other 12 patients (224 teeth) were carried out with light-cure veneer bonding technique.
随机选取12例(220颗牙齿)患者进行托槽直接粘结技术，12例患者(224颗牙齿)进行光固化贴面粘结托槽技术。
The direct bonding joint between cemented carbide and nodular cast iron and the indirect bonding joint by using nickel foil as intermediate layer were obtained by HIP diffusion bonding process.
用热等静压扩散连接法获得了硬质合金与球墨铸铁的直接连接接头和以镍箔为中间夹层的间接连接接头。
Successful Silicon to silicon direct bonding(SDB)mainly depend on the hydrophilicity treatment of silicon surface. Micro mechanism of hydrophilicity has been analyzed in the paper for the first time.
硅片直接键合（SDB） 技术的关键在于硅片表面的亲水处理，本文分析了亲水处理之微观机理。
Direct wafer bonding is a new process of material integrating and has received tremendous attention in the research of optoelectronics and microelectronics field.
摘要晶片直接键合技术是材料集成的一项新工艺，是近年来集成光电子领域的研究热点之一。
Direct wafer bonding is a new process of material integrating and has received tremendous attention in the research of optoelectronics and microelectronics field.
晶片直接键合技术是材料集成的一项新工艺，是近年来集成光电子领域的研究热点之一。
Meshed bonding enables a site to achieve a considerably lower ground resistance pathway for diverting direct lightning strikes to earth ground.
网状等电位连接能使现场得到一条相对较低的地阻路径，分流直击雷入地。
The direct reduced iron is a high-quality material after coldly bonding, and the utilizable value of high-purity iron powder is higher.
直接还原铁粉经冷固结成型后即为电炉炼钢的优质原料，而高纯铁粉的利用价值更高。
Other than conventional direct thermal bonding, this method has higher efficiency, lower deformation and can realize selective package.
与常用的直接热键合相比，具有效率高、变形小、可实现选择封装等优点。
The bonding quality of new to old concrete has a direct effect in the quality of the construction.
新旧混凝土结合的质量直接影响维修加固成果的质量。
Pulse electroplating coating have more powerful hardness and bonding strength than direct current plating, the amounts of crack and porosity are lower than direct current plating.
脉冲镀层硬度和结合力均高于直流镀层，镀层孔隙率、表面裂纹数量和裂纹程度都小于直流镀层。
Pulse electroplating coating have more powerful hardness and bonding strength than direct current plating, the amounts of crack and porosity are lower than direct current plating.
脉冲镀层硬度和结合力均高于直流镀层，镀层孔隙率、表面裂纹数量和裂纹程度都小于直流镀层。
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