研究了基片摆动和基片自转的磁控溅射系统中基片摆动角振幅和基片自转角速度对磁控溅射膜厚均匀性的影响。
The influence of rotation speed and pendulum amplitude on the thickness uniformity of film deposited by radio frequency magnetron sputtering system with rotation and pendulum was researched.
介绍了基于FPGA的太阳能真空集热管磁控溅射镀膜机控制系统的整体设计和工程实现过程。
This paper introduces an integrated design and implementation of the SCS control system based on FPGA.
通过在离子束溅射镀膜系统上的实验研究并用仿真模型进行回归分析，给出了准确的余弦分布函数指数，最终建立能够定量计算的仿真模型。
By some experimental researches on IBSD system and regression analyzing, the exponent of cosine distribution is determined and the emluator are completed for quantificationally simulation.
在离子束溅射镀膜机的膜厚控制系统的研究中，由于采用了现代检测手段，使测量精度大大提高。
In the research of the membrane thickness control system of IBS plating machine, as having adopted modern detection means, measure precision improves greatly.
该溅射源与现有的用于大批量生产的立式串级系统完全兼容。
The source is fully compatible with existing vertical In-Line systems for high volume production.
还公开了一种用于预测一种目标的溅射效率的方法以及一种用于量化多晶物质的结构均匀性的系统。
A method to predict the sputtering efficiency of a target is also described as well as a system for quantifying the texture homogeneity of a polycrystalline material.
系统地研究了溅射功率对沉积速率、薄膜结构、组织形貌及接触性能的影响。
The influences of the sputtering power on deposition rate, film structure, and contact performance of the film prepared on CdZnTe substrate have been investigated.
该系统集脉冲阴极弧离子镀、直流阴极弧离子镀、磁控溅射和电子束蒸发等镀膜工艺以及气体和金属离子注入于一体。
The system include pulse cathodic arc ion deposition, direct current cathodic arc ion deposition, magnetic sputtering and electronic beam evaporation technologies.
作为重点，对真空室、真空系统、工件架、磁控溅射靶、控制系统等进行了相应的设计分析和计算。
Special importance were attached to the design and calculation of deposition chamber, vacuum system, sample system, sputtering cathode and control system.
摘要：本文详细介绍了气体离子源增强磁控溅射(气离溅射)反应离子镀膜技术和系统配置。
ABSTRACT: in this paper a reactive ion plating method and system configuration of Gas ion source enhanced Magnetron Sputtering (GIMS) is presented in details.
摘要：本文详细介绍了气体离子源增强磁控溅射(气离溅射)反应离子镀膜技术和系统配置。
ABSTRACT: in this paper a reactive ion plating method and system configuration of Gas ion source enhanced Magnetron Sputtering (GIMS) is presented in details.
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