接着，使所述焊料回流以接合所述多个第一柱和所 述多个第二柱，并且切割所述母器件晶片。
Then, the solder is reflowed to bond the first and second posts, and the mother device wafer is diced.
多个导电内引线被接合至该区域周围的基片，以连接至该半导体晶片。
A plurality of electrically conductive inner leads are bonded to the substrate around the area for connection to the semiconductor die.
多个导电内引线被接合至该区域周围的基片，以连接至该半导体晶片。
A plurality of electrically conductive inner leads are bonded to the substrate around the area for connection to the semiconductor die.
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