本文介绍了半导体晶圆制造车间层控制的内容及方法。
Content and methods of shop-floor control in semiconductor wafer fabricati…
它提供了全面的半导体晶圆制造服务、技术供应商和系统公司。
It provides comprehensive wafer fabrication services and technologies to semiconductor supplier and system companies.
针对晶圆制造系统的多重入特性，提出了层周期、逻辑层数等概念。
In view of the multiple re-entrant characteristics of wafer manufacturing systems, this paper presents some concepts such as cycle time per layer and logical layer number.
而建一座高度自动化的、可以用太阳能晶圆制造太阳能电池的工厂则需六个月至一年时间。
It takes six months to a year to build a highly automated factory to make solar cells from solar wafers.
针对半导体晶圆制造系统中瓶颈设备动态漂移的特性，提出一种动态瓶颈实时派工策略。
According to the characteristics of dynamic bottleneck in semiconductor wafer fabrication system (SWFS), a dynamic bottleneck real-time dispatching (DBRD) strategy was proposed.
针对半导体晶圆制造系统中瓶颈设备动态漂移的特性，提出一种动态瓶颈实时派工策略。
The general structure of semiconductor manufacturing system and solutions of its information exchanging are presented.
2010年10月27日英特尔在亚洲的首个晶圆制造厂日前在中国东北城市大连正式投产。
2010-10-27 U. S. computer chip giant Intel Corporation's first chip plant in Asia began production in northeast China's Dalian city.
晶圆制造为现今最复杂与高度竞争制造环境之一，因此，充分利用其现有产能来满足顾客需求，为一相当重要的课题。
Wafer fabrication is one of the most complex and high competence manufacturing. How to fully utilize the machine capacity to meet customer demand is a very important topic.
LCTI - M的目标是开发一种晶圆级制造流程，这将使热成像仪普及应用到美军每一名士兵。
The goal of LCTI-M is to develop a wafer scale manufacturing process that will make thermal imagers affordable and accessible to every warfighter.
在最近的技术评论会议上，Sachs提出使用一种被称为“直接圆晶”的新制造流程可以降低成本。
Speaking at the recent Technology Review Emtech conference, Sachs says he can lower costs using a new manufacturing process called "direct wafer."
过去几十年，随着晶圆尺寸的不断增加，芯片制造商们可以利用单片晶圆上制造出更多的芯片。
Over the past several decades, the wafers upon which chips are made have steadily increased in size, enabling manufacturers to cram more chips on each disk.
现代洁净室中的所有机器都是用来制造300毫米硅晶圆的。
Every machine in a modern clean room is built around 300-mm wafers.
特许半导体制造有限公司(特许)是世界上最大的专用半导体晶圆代工厂，位于新加坡。
Chartered semiconductor Manufacturing Ltd (Chartered) is one of the world's top dedicated semiconductor foundries in Singapore.
ESD的问题不仅对于成品来说很重要，在制造过程中（从晶圆制程、封装到组装整个系统）也是很重要的课题。
ESD is an issue not only for finished products but also during their manufacture, from wafer fabrication to packaging to the assembly of complete systems.
介绍了晶圆键合工艺、技术要求、应用选择以及对MEMS的作用；展示了MEMS制造技术和应用前景。
Introduces wafer bonding process, technical requirements, application choice and Interaction for MEMS, and showing MEMS fabrication technology and application prospects.
集成电路粘片机是将半导体晶圆上微芯片贴装到引线基架的半导体制造后工序关键性生产设备。
IC Die Bonder is key equipment which binds semiconductor microchip onto Lead Frame in semiconductor back-end production.
一种晶圆级镜头模组及其制造方法。
The invention relates to a wafer-level lens module and a manufacturing method thereof.
首席执行官欧德宁展示了英特尔的一个下一代的下一代22纳米硅芯片制造过程中取得第一个晶圆。
CEO Paul Otellini showed off Intel's first wafer of silicon chips made with a next-next-generation 22-nanometer manufacturing process.
一种在半导体与罩幕制造中改善晶圆上的图案化特征结构的临界尺寸均匀性的方法。
A method for improving the critical dimension uniformity of a patterned feature on a wafer in semiconductor and mask fabrication is provided.
为了简化运输和尽可能降低被污染的风险，芯片制造商利用“前开式标准晶圆盒”即所谓的FOUP来搬运晶圆。每个无尘超净的晶圆盒中可放置25块硅晶圆。
To simplify transportation and minimize the risk of contamination, fabs make use of "front-opening unified pods, " or FOUPs. Each one holds 25 wafers in a sterile, clean environment.
作为半导体制造领域的一项新兴的使能技术，晶圆直接键合已经在越来越多的领域发挥了重要的作用。
As one of the newly-emerged enabling technologies, wafer direct bonding has been playing key roles in more and more fields.
作为半导体制造领域的一项新兴的使能技术，晶圆直接键合已经在越来越多的领域发挥了重要的作用。
As one of the newly-emerged enabling technologies, wafer direct bonding has been playing key roles in more and more fields.
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