半导体物理学是凝聚态物理学的一个重要分支，也是现代微电子器件工艺学的理论核心。
Semiconductor physics is recognized as one of the major areas of condensed matter physics and the core of modern micro-electronics device technology.
本文介绍了利用半导体硅材料制作的真空微电子器件的核心部件，场致发射硅锥阴极，的工艺研究及实验结果。
A process for the fabrication of Si cone cathode for the build up of vacuum microelectronic devices is proposed and its experimental results are given.
目前承担微电子专业方向的主干课程：固态电子论、微电子器件与原理、集成电路设计，微电子工艺等课程。
It has key courses of microelectronics: solid-state electronic theory, microelectronic devices and principles, integrated circuit design, micro-electronics processing, etc.
本文介绍了真空微电子器件场发射金属尖阵列阴极的制备工艺技术。
This paper describes a fabrication technology of metal tip field emission arrays (FEA) for the vacuum microelectronic devices.
本文介绍了真空微电子器件场发射金属尖阵列阴极的制备工艺技术。
This paper describes a fabrication technology of metal tip field emission arrays (FEA) for the vacuum microelectronic devices.
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