本实验显示经过最佳化的传输线路设计与凸块分布，低成本高效能的覆晶封装结构目标可以达成。

With optimized circuit design and bump layout, high performance transmission lines for flip chip packages can be achieved using dry film as the masking material for the bump plating.

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两种方法所获产品纯度相差不大，显示了聚焦微波助提法提取杜仲胶的高效能。

These results implied that the focused microwave-assisted extraction method was a promising method for the extraction of guttapercha.

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