通过对静电封接结构的受力分析，建立了静电封接后弹性膜片的热失配应力数学模型。
The stress of anodic bonding is analysed and the math model of no match thermal stress about anodic bonded elastic diaphragm is built.
在使用不当方面，主要是静电放电(esd)损伤和过电损伤(EOS)，EOS损伤中包括输出端失配、加电顺序等操作不当引入的过电应力等。
As for application problems, the main failure reasons are damage caused by ESD and EOS, including mismatch in the output ports and incorrect biasing sequence, etc.
提出了一种利用静电作用下悬臂梁的吸合电压提取MEMS薄膜沿厚度方向的平均应力梯度及弹性模量的方法，该方法的关键在于实现悬臂梁吸合电压的快速、精确计算。
A novel method for calculating Youngs modulus and residual stress of a MEMS film is proposed based on pull-in voltages of a set of fixed-fixed beams.
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