当电子设备制造商希望能更小的设备里实现更快的计算能力和更大的内存时，层叠式集成电路的发展前景越来越有活力。
They're vital as consumer electronics makers look to cram more processing power and memory into smaller devices.
集成电路粘片机是将半导体晶圆上微芯片贴装到引线基架的半导体制造后工序关键性生产设备。
IC Die Bonder is key equipment which binds semiconductor microchip onto Lead Frame in semiconductor back-end production.
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