由此提出控制预镀铜层麻点的有效措施。
Thereby, the available ways to control pits formation on strike copper deposits were presented.
化学镀铜层的显微结构受基体的显著影响。
The microstructure of electroless copper deposit is greatly effected by the substrate upon which deposition occurs.
它可以提高镀铜层的表面抗氧化性能、耐磨性能以及光亮性。
It can improve the properties of the passive film, such as abrasive resistance, resistance to oxidation and lightness.
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