还将回顾理解表面镀层以及与之相关的各种分析方法、效模式分析方法。
Various analytical and failure mode analysis techniques in understanding surface finishes and their related problems will also be reviewed.
在半导体电子封装，电子制造，表面镀层及涂覆，失效模式分析和可靠性评估方面具有丰富经验。
He has extensive experience in the fields of semiconductor and electronic packaging, electronic manufacturing, surface finishes and coatings, failure mode analysis and reliability assessment. Dr.
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